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公开(公告)号：US20170155417A1
公开(公告)日：2017-06-01
申请号：US15324573
申请日：2015-03-31
Applicant: LG ELECTRONICS INC.
Inventor： Daejin JEONG , Changshik MINN , Seokgyu KIM
IPC: H04B1/3888
CPC classification number: H04B1/3888
Abstract: An amorphous alloy-deposited case includes: a molded article of a plastic or a metal material; and an amorphous alloy layer deposited on a top side of the molded article, and is characterized in that the thickness of the amorphous alloy layer ranges from 0.1 um to 2.5 um.
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