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公开(公告)号：US20250153405A1
公开(公告)日：2025-05-15
申请号：US18839665
申请日：2023-02-23
Applicant: LG ELECTRONICS INC.
Inventor： Wonseok CHOI , Mingoan JUNG , Soonho CHOI
Abstract: The mold apparatus enables the integration of a plurality of rim-shaped cores each corresponding to the shape of a case forming the exterior of a display device, and thus a plurality of cavities may be formed on a parting surface without having to increase the thickness or size of a mold.
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