公开(公告)号：US12284746B2

公开(公告)日：2025-04-22

申请号：US17424143

申请日：2020-01-20

Applicant: LG ELECTRONICS INC.

Inventor： Hyunwoo Park ,  Wooil Kim ,  Gyegwang Lee ,  Imjun Cho

IPC: H05H1/34 ,  H05H1/28 ,  H05H1/42

Abstract: The present disclosure relates to a thermal plasma processing apparatus capable of efficiently using thermal plasma and securing a reaction time for the thermal decomposition of the processing gas. A Thermal plasma processing apparatus according to an embodiment of the present disclosure includes a torch part in which an arc is generated between a negative electrode and a positive electrode, and in which a processing gas to be thermally decomposed by the arc is injected between the negative electrode and the positive electrode, a power supply part configured to be connected to the negative electrode and the positive electrode and to apply a high voltage between the negative electrode and the positive electrode, and a reaction part configured to communicate with the torch part and to generate turbulence in the processing gas passing through the torch part.