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公开(公告)号:US20210259062A1
公开(公告)日:2021-08-19
申请号:US17179925
申请日:2021-02-19
Applicant: LG Electronics Inc.
Inventor: Juwon KIM , Eunjin JANG , Jongwon HWANG , Yongsoo LEE , Hyunwoo JUN , Jaekyung YANG
Abstract: An induction heating type cooktop includes: a case, a cover plate that is coupled to an upper end of the case and that includes an upper plate arranged to receive a target object, a working coil that is disposed in the case and that is configured to heat the target object, a thermal insulation material disposed on the working coil, and a heating thin film coating that is disposed on a surface of the upper plate of the cover plate or a surface of the thermal insulation material and that has a stacked structure in which an adhesive layer and a heating layer are consecutively stacked.
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公开(公告)号:US20210274603A1
公开(公告)日:2021-09-02
申请号:US17180014
申请日:2021-02-19
Applicant: LG Electronics Inc.
Inventor: Eunjin JANG , Wontae KIM , Juwon KIM , Jongwon HWANG , Taeho KIM , Taehee KIM
Abstract: An induction heating type cooktop includes: a case, a cover plate that is coupled to an upper end of the case and that includes an upper plate arranged to receive a target object, a working coil that is disposed in the case and that is configured to heat the target object, a heating module that is disposed at a lower surface of the upper plate of the cover plate and that includes an electrically conductive material, and a thermal insulation material disposed between the heating module and the working coil.
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公开(公告)号:US20240080947A1
公开(公告)日:2024-03-07
申请号:US18507744
申请日:2023-11-13
Applicant: LG Electronics Inc.
Inventor: Juwon KIM , Eunjin JANG , Jongwon HWANG , Yongsoo LEE , Hyunwoo JUN , Jaekyung YANG
CPC classification number: H05B6/062 , H05B6/04 , H05B6/1263 , H05B2206/022
Abstract: An induction heating type cooktop includes: a case, a cover plate that is coupled to an upper end of the case and that includes an upper plate arranged to receive a target object, a working coil that is disposed in the case and that is configured to heat the target object, a thermal insulation material disposed on the working coil, and a heating thin film coating that is disposed on a surface of the upper plate of the cover plate or a surface of the thermal insulation material and that has a stacked structure in which an adhesive layer and a heating layer are consecutively stacked.
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公开(公告)号:US20210259066A1
公开(公告)日:2021-08-19
申请号:US17180008
申请日:2021-02-19
Applicant: LG Electronics Inc.
Inventor: Jongwon HWANG , Hyunwoo JUN , Jaekyung YANG , Eunjin JANG , Juwon KIM
IPC: H05B6/12
Abstract: An induction heating type cooktop includes: a case, a cover plate that is coupled to an upper end of the case and that includes an upper plate arranged to receive a target object, a working coil that is disposed in the case and that is configured to heat the target object, a thermal insulation material disposed on the working coil, and a heating thin film coating that is disposed on a surface of the upper plate of the cover plate or a surface of the thermal insulation material and that has a stacked structure in which an adhesive layer and a heating layer are consecutively stacked.
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