Multi-slot die coater
    1.
    发明授权

    公开(公告)号:US12103036B2

    公开(公告)日:2024-10-01

    申请号:US17922723

    申请日:2021-08-20

    CPC classification number: B05C5/0262

    Abstract: There is provided a multi-slot die coater that is easy to adjust a coating gap and can achieve widthwise deviation control of the coating gap. According to the present disclosure, a step is formed between rear surfaces of die blocks through a fixing block including a step adjustment block. The step adjustment block has a preset thickness, and the step adjustment block is mounted between any one die block and a flat plate-shaped block, and the other die block is coupled to the flat plate-shaped block, and thus the step is naturally formed between the rear surfaces of the die blocks by the coupling of the die blocks to the fixing block including the step adjustment block.

    Multi-Slot Die Coater
    3.
    发明申请

    公开(公告)号:US20230080280A1

    公开(公告)日:2023-03-16

    申请号:US17801074

    申请日:2021-07-30

    Abstract: A multi-slot die coater has improved a deviation in a width direction of a slot gap caused by a structural feature including a thin die block. The multi-slot die coater including a lower slot and an upper slot includes a lower die block; an intermediate die block disposed on the lower die block to form the lower slot therebetween; and an upper die block disposed on the intermediate die block to form the upper slot therebetween, wherein the intermediate die block comprises a manifold that accommodates a coating solution, and is communicatively connected to the upper slot, and wherein a shortest distance from distances from any points on a bottom surface of the manifold to any points on the second surface is equal to or greater than 10 mm.

    Slot Die Coater with Improved Coating Solution Flow

    公开(公告)号:US20230201861A1

    公开(公告)日:2023-06-29

    申请号:US17926801

    申请日:2021-10-12

    CPC classification number: B05C5/0254 H01M10/0404

    Abstract: Provided is a slot die coater with a uniform flow of coating solution without stagnation. The slot die coater includes at least two die blocks; a shim plate provided between the two die blocks to form a slot; and a manifold provided in the die block and communicatively connected with the slot as a chamber in the shape of indention accommodating a coating solution, wherein the coating solution is discharged and applied to a surface of a continuously traveling substrate through a discharge port communicatively connected with the slot, and a ratio B/S of a manifold length B (mm) to a manifold cross-sectional area S (cm2) in a cross section along a traveling direction of the substrate is in a range of 1.9 to 9.8.

    Multi-Slot Die Coater
    5.
    发明公开

    公开(公告)号:US20230166287A1

    公开(公告)日:2023-06-01

    申请号:US17922723

    申请日:2021-08-20

    CPC classification number: B05C5/0262

    Abstract: There is provided a multi-slot die coater that is easy to adjust a coating gap and can achieve widthwise deviation control of the coating gap. According to the present disclosure, a step is formed between rear surfaces of die blocks through a fixing block including a step adjustment block. The step adjustment block has a preset thickness, and the step adjustment block is mounted between any one die block and a flat plate-shaped block, and the other die block is coupled to the flat plate-shaped block, and thus the step is naturally formed between the rear surfaces of the die blocks by the coupling of the die blocks to the fixing block including the step adjustment block.

    Slot Die Coater
    7.
    发明申请

    公开(公告)号:US20230140800A1

    公开(公告)日:2023-05-04

    申请号:US17918261

    申请日:2021-10-27

    Abstract: Provided is a slot die coater capable of uniformly forming a coating boundary formed in a machine direction (MD). The slot die coater includes at least two die blocks; a shim plate provided between the two die blocks to form a slot; and a manifold provided in the die block and configured to accommodate a coating solution, wherein the coating solution is discharged and applied to a substrate through a discharge port communicatively connected with the slot an end of the shim plate is moved backward relative to a die lip which is a front end of the die block so as to be offset relative to the die lip.

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