公开(公告)号：US20250132242A1

公开(公告)日：2025-04-24

申请号：US18722178

申请日：2022-11-23

Applicant: LG INNOTEK CO., LTD.

Inventor： Seung Joon KIM ,  Do Yun LEE ,  Dae Hwi JEONG

IPC: H01L23/498 ,  G06K19/02

Abstract: A smart IC substrate according to an embodiment includes a substrate including a first surface and a second surface opposite to the first surface; a first circuit pattern disposed on the first surface; and a space region between the first circuit pattern, wherein the substrate includes a plurality of via holes passing through the first surface and the second surface, wherein the substrate has a first region and a second region other than the first region, wherein the first circuit pattern includes a first circuit pattern part and a second circuit pattern part having different thicknesses, wherein a thickness of the first circuit pattern part is greater than a thickness of the second circuit pattern part, wherein the first circuit pattern part is disposed in the first region and the second region, wherein the second circuit pattern part is disposed only in the first region, and wherein the second circuit pattern part is disposed in at least one of a position that overlaps the via hole and a position that does not overlap the via hole in a thickness direction of the substrate.