公开(公告)号：US20230119237A1

公开(公告)日：2023-04-20

申请号：US17906214

申请日：2021-03-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Dong Hwa LEE ,  Yong Suk KIM

IPC: H05K1/03 ,  H05K1/05 ,  H05K1/18 ,  H05K1/11

Abstract: A circuit board according to an embodiments includes an insulating portion comprising a plurality of insulating layers, wherein the insulating portion includes: a first insulating portion; a second insulating portion disposed on the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; and a third insulating portion disposed under the first insulating portion and having a coefficient of thermal expansion corresponding to the first insulating portion; wherein the first insulating portion includes a prepreg including glass fibers, and wherein the second and third insulating portions include a resin coated copper (RCC) with a coefficient of thermal expansion in the range of 10 to 65 (10−6 m/m·k).

公开(公告)号：US20220256699A1

公开(公告)日：2022-08-11

申请号：US17621944

申请日：2020-06-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Suk KIM ,  Dong Hwa LEE

IPC: H05K1/11 ,  H05K1/09

Abstract: A circuit board according to an embodiment comprises: an insulating layer; a circuit pattern disposed above the top surface of or below the bottom surface of the insulating layer; and a buffer layer disposed between the insulating layer and the circuit pattern, the buffer layer comprising carbon atoms, nitrogen atoms, oxygen atoms, silicon atoms, sulfur atoms, and metal atoms, wherein: the ratio of the carbon atoms to the metal atoms ((carbon atom/copper atom)*100) is 5-7; the ratio of the nitrogen atoms to the metal atoms ((nitrogen atom/copper atom)*100) is 1.5-7; the ratio of the oxygen atoms to the metal atoms ((oxygen atom/copper atom)*100) is 1.1-1.9; and the ratio of the silicon atoms to the metal atoms ((silicon atom/copper atom)*100) is 0.5-0.9; and the ratio of the sulfur atoms to the metal atoms ((sulfur atom/copper atom)*100) is 0.5-1.5.

公开(公告)号：US20190381862A1

公开(公告)日：2019-12-19

申请号：US16471488

申请日：2017-12-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Won Jin KIM ,  Dong Hwa LEE ,  In Jae LEE

IPC: B60H1/22 ,  H05B3/06 ,  H05B3/12 ,  H05B3/14 ,  H05B3/50

Abstract: According to one embodiment of the present invention, a heating rod comprises: a first thermal diffusion plate; a ceramic substrate arranged on the first thermal diffusion plate and having a heating element arranged therein; and a second thermal diffusion plate arranged on the ceramic substrate, wherein the first thermal diffusion plate and the second thermal diffusion plate are respectively stacked in a plurality of layers. Since the first thermal diffusion plate and the second thermal diffusion plate are stacked in the plurality of layers, a heating rod having a high thermal efficiency and being capable of fast heating and a vehicular heating device including the same can be obtained.

公开(公告)号：US20220287174A1

公开(公告)日：2022-09-08

申请号：US17636063

申请日：2020-08-25

Applicant: LG INNOTEK CO., LTD.

Inventor： Yong Suk KIM ,  Dong Hwa LEE

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/05

Abstract: A circuit board according to an embodiment includes a first insulating portion including at least one insulating layer; a second insulating portion disposed on the first insulating portion and including at least one insulating layer; and a third insulating portion disposed under the first insulating portion and including at least one insulating layer; wherein the insulating layer constituting the first insulating portion includes a prepreg containing glass fibers, and wherein each of the insulating layers constituting the second and third insulating portions is made of resin coated copper (RCC).

公开(公告)号：US20230047621A1

公开(公告)日：2023-02-16

申请号：US17793100

申请日：2021-01-13

Applicant: LG INNOTEK CO., LTD.

Inventor： Dong Hwa LEE

IPC: H05K1/11 ,  H05K3/38 ,  H05K3/40 ,  H05K1/18 ,  H05K1/05

Abstract: A circuit board according to the embodiment includes a first substrate including a first insulating layer and a first pad disposed on an upper surface of the first insulating layer; a second substrate including a second insulating layer including a via hole and a metal layer formed on upper and lower surfaces of the second insulating layer and an inner wall of the via hole; a third insulating layer disposed between the first substrate and the second substrate and having a first opening in a region overlapping the via hole; a via filling the via hole and disposed on the first pad exposed through the opening of the third insulating layer; and a second pad disposed on the via and the metal layer disposed on an upper surface of the second insulating layer.