公开(公告)号：US20230176318A1

公开(公告)日：2023-06-08

申请号：US17911955

申请日：2021-03-19

Applicant: LG INNOTEK CO., LTD.

Inventor： Jun Taek LEE ,  Chung Min MUN ,  Min Jung SHIN

IPC: G02B7/04 ,  G03B13/36

CPC classification number: G02B7/04 ,  G03B13/36

Abstract: One embodiment comprises: a cover member including an upper plate and a side plate connected to the upper plate; a housing arranged in the cover member; a bobbin arranged in the housing; a coil coupled to the bobbin; a magnet which is arranged in the housing and faces the coil; a base arranged under the bobbin; and a first buffer unit arranged on the top surface of the bobbin corresponding to or facing the upper plate of the cover member, wherein the cover member includes a protrusion part extending in the direction toward the bobbin from the upper plate, and the distance in the optical axis direction between the protrusion part and the top surface of the bobbin is no greater than the distance in the optical axis direction between the first buffer unit and the inner surface of the upper plate of the cover member.

公开(公告)号：US20240196548A1

公开(公告)日：2024-06-13

申请号：US18555460

申请日：2022-04-08

Applicant: LG INNOTEK CO., LTD.

Inventor： Min Oak KIM ,  Min Jung SHIN ,  Woo Seok LEE ,  Ki Eun YOON

IPC: H05K5/00

CPC classification number: H05K5/0052 ,  H05K5/006

Abstract: Electric equipment comprises: a housing; a printed circuit board disposed in the housing and including a first hole; and a cover coupled to the upper surface of the housing and including a second hole, wherein the housing comprises: a first region arranged to pass through the first hole; a second region disposed above the first region and arranged to pass through the second hole; and a third region disposed above the second region and placed on the upper surface of the cover.