公开(公告)号：US20230209162A1

公开(公告)日：2023-06-29

申请号：US18000043

申请日：2021-05-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Gon KIM ,  Han Ul KWON

IPC: H04N23/54 ,  H04N23/55

CPC classification number: H04N23/54 ,  H04N23/55

Abstract: According to an embodiment of the present invention, disclosed is a camera device comprising: a housing; a lens assembly including at least one lens; a driving unit for moving the lens assembly; a main substrate on which an image sensor is provided; and a first substrate and a second substrate electrically connected to the driving unit and arranged on facing side surfaces of the housing to be spaced apart from each other, wherein the main substrate includes a first connection member connected to the first substrate and a second connection member connected to the second substrate.

公开(公告)号：US20230064678A1

公开(公告)日：2023-03-02

申请号：US17796072

申请日：2021-01-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Hee Se LEE ,  Tae Gon KIM

IPC: H04N5/225

Abstract: A camera module according to an embodiment of the present invention comprises: a circuit board; a light source and an image sensor arranged on the circuit board; a housing arranged on the circuit board; an optical member arranged on the light source and including an electrode; and a conductive portion which is arranged in the housing and electrically connects the electrode of the optical member to the circuit board.

公开(公告)号：US20250097555A1

公开(公告)日：2025-03-20

申请号：US18969383

申请日：2024-12-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Tae Gon KIM ,  Han Ul KWON

IPC: H04N23/54 ,  H04N23/55

Abstract: According to an embodiment of the present invention, disclosed is a camera device comprising: a housing; a lens assembly including at least one lens; a driving unit for moving the lens assembly; a main substrate on which an image sensor is provided; and a first substrate and a second substrate electrically connected to the driving unit and arranged on facing side surfaces of the housing to be spaced apart from each other, wherein the main substrate includes a first connection member connected to the first substrate and a second connection member connected to the second substrate.