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    DUAL LENS DRIVE DEVICE, DUAL CAMERA MODULE, AND OPTICAL DEVICE
    1.
    发明申请
    DUAL LENS DRIVE DEVICE, DUAL CAMERA MODULE, AND OPTICAL DEVICE 有权

    公开(公告)号：US20230069492A1

    公开(公告)日：2023-03-02

    申请号：US18047309

    申请日：2022-10-18

    申请人： LG INNOTEK CO., LTD.

    发明人： Kap Jin LEE ,  Yong Nam CHOI ,  Do Yoon KIM ,  Min Soo KIM ,  Jung Hwan KIM ,  Tae Young KIM

    IPC分类号： G02B27/64 ,  G03B11/04 ,  H04N5/232 ,  H01F7/16

    摘要： The present embodiment relates to a dual lens drive device that comprises: a housing; a first bobbin which is disposed to move in a first direction inside the housing; a second bobbin which is disposed to move in the first direction inside housing and is spaced apart from the first bobbin; a first coil which is disposed on the first bobbin; a second coil which is disposed on the second bobbin; a magnet which is disposed in the housing and faces the first coil and the second coil; a base which is disposed below the housing; a substrate which comprises a circuit member having a third coil disposed to face the magnet between the housing and the base; and a support member which movably supports the housing with respect to the substrate, wherein the housing is integrally formed.

    CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
    2.
    发明申请
    CAMERA MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME 审中-公开
    相机模块和电子设备，包括它们

    公开(公告)号：US20140036146A1

    公开(公告)日：2014-02-06

    申请号：US13959231

    申请日：2013-08-05

    申请人： LG INNOTEK CO., LTD.

    发明人： Yong Nam CHOI

    IPC分类号： H04N5/225

    CPC分类号： H04N5/2254 ,  H04N5/2253

    摘要： An exemplary embodiment of the present disclosure provides one or more pieces of lenses, a housing formed therein with the one or more pieces of lenses, and a PCB (Printed Circuit Board) fixed to the housing, mounted with an image sensor converting an optical image having passed the one or more pieces of lenses to an electrical signal and formed at a bottom surface with a solder ball.

    摘要翻译： 本公开的示例性实施例提供一个或多个透镜，其中形成有一个或多个透镜的壳体和固定到壳体的PCB（印刷电路板），安装有转换光学图像的图像传感器 已经将一个或多个透镜通过电信号并且在底面形成有焊球。