HARDWARE PACKAGING
    1.
    发明申请
    HARDWARE PACKAGING 审中-公开

    公开(公告)号:US20190009962A1

    公开(公告)日:2019-01-10

    申请号:US16028914

    申请日:2018-07-06

    Abstract: A hardware packaging assembly and method are provided. A hardware component has a front appearance surface and a back mounting surface. A package backing has a forward receiving surface to receive the back mounting surface of the hardware component. A retention feature protrudes from the package backing to engage the hardware component with an interference fit. The retention feature retains the hardware component on the package backing while maintaining the front appearance surface exposed.

Patent Agency Ranking