公开(公告)号：US10914903B2

公开(公告)日：2021-02-09

申请号：US16349158

申请日：2018-06-15

Applicant: LINKTEL TECHNOLOGIES CO., LTD

Inventor： Ning Li ,  Jian Zhang ,  Xianwen Yang ,  Tianshu Wu ,  Linke Li

IPC: G02B6/42 ,  G02B6/44

Abstract: The invention provides an optical module including a circuit board, an optical component and an electrical interface, and the circuit board is provided with a signal rate transmission chip, a laser driver chip, a transimpedance limiting amplifier chip, a vertical cavity surface-emitting laser chip array and a photodetector chip array, and the signal rate transmission chip is electrically connected with the laser driver chip and the transimpedance limiting amplifier chip through the first microstrip line, and the optical component includes an interface end MT ferrule, and a light-emitting ribbon optical cable and a light-receiving ribbon optical cable both connected with the interface end MT ferrule, the light-emitting ribbon optical cable is coupled and aligned with the vertical cavity surface-emitting laser chip array, and the light-receiving ribbon optical cable is coupled and aligned with the photodetector chip array, and the electrical interface includes a gold finger disposed on one side of circuit board. The gold finger and the signal rate transmission chip are electrically connected through the second microstrip line. The present invention achieves a high-density optical package while optimizing the complexity of optical path coupling.