公开(公告)号：US20230413389A1

公开(公告)日：2023-12-21

申请号：US18035251

申请日：2021-11-05

Applicant: LINTEC CORPORATION

Inventor： Go ONISHI ,  Takuya OSHIMA ,  Yasunao MIYAZAWA

IPC: H05B3/34 ,  H05B3/03 ,  H05B3/10

CPC classification number: H05B3/34 ,  H05B3/10 ,  H05B3/03

Abstract: A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a pair of electrodes; and a first power feeder provided for one of the electrodes and a second power feeder provided for the other of the electrodes, in which provided that the number of the conductive linear bodies is N, a resistance value of each conductive linear body is r, a resistance value of each electrode is R, a resistance value of each electrode between the n-th conductive linear body and the (n−1)th conductive linear body counted from a side at which the first power feeder and the second power feeder are provided is Rn, the wiring sheet satisfies all conditions represented by numerical formulae (F1) to (F3) below,


r/R≤300  (F1)



Rn≤Rn−1  (F2)



where n is an integer of 2 or more,



0

公开(公告)号：US20230147333A1

公开(公告)日：2023-05-11

申请号：US17912435

申请日：2021-03-12

Applicant: LINTEC CORPORATION

Inventor： Go ONISHI ,  Takuya OSHIMA

IPC: H05B3/12 ,  H05B3/26 ,  H05B3/03

CPC classification number: H05B3/12 ,  H05B3/267 ,  H05B3/03 ,  H05B2203/007

Abstract: A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a pair of electrodes; and a first power feeder provided for one of the electrodes and a second power feeder provided for the other of the electrodes. Assuming that the number of the conductive linear bodies is N, a resistance value of a n-th conductive linear body counted from a side at which the first power feeder and the second power feeder are provided is rn, and a resistance value of the electrodes is R, all of conditions represented by numerical formulae (F1), (F2), and (F3) below are satisfied. (F1): r1/R≤300 (F2): rn+1≤rn (In the formula (F2), n is an integer of 1 or more) (F3): 0

公开(公告)号：US20230078492A1

公开(公告)日：2023-03-16

申请号：US17923486

申请日：2021-05-06

Applicant: LINTEC CORPORATION

Inventor： Takuya OSHIMA ,  Takashi MORIOKA

IPC: H05B3/12 ,  H05B3/03 ,  H05B3/20

Abstract: A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a cured product layer supporting the pseudo sheet structure; and a pair of electrodes in direct contact with the conductive linear bodies. The cured product layer is formed from a cured product of a curable adhesive agent, and a storage modulus at 23 degrees C of the cured product layer is in a range from 5.0×106 Pa to 1.0×1010 Pa.