公开(公告)号：US20200335471A1

公开(公告)日：2020-10-22

申请号：US16851330

申请日：2020-04-17

Applicant: LINTEC Corporation

Inventor： Akiko UMEDA ,  Manabu MIYAWAKI ,  Hidekazu NAKAYAMA ,  Hiroki INOUE ,  Toshifumi IMURA

IPC: H01L23/00 ,  H01L33/62 ,  C09J183/04 ,  C08G77/388

Abstract: The present invention provides a die bonding material containing the following component (A) and a solvent and having a refractive index (nD) at 25° C. of 1.41 to 1.43 and a thixotropic index of 2 or more, a light-emitting device including an adhesive member derived from the die bonding material, and a method for producing the light-emitting device. The die bonding material of the present invention is preferably used for fixing a light emitting element at a predetermined position.Component (A): a curable polysilsesquioxane compound having a repeating unit represented by the following formula (a-1) and satisfying predetermined requirements related to 29Si-NMR and mass average molecular weight (Mw) R1-D-SiO3/2   (a-1) [wherein R1 represents a fluoroalkyl group represented by a compositional formula: CmH(2m-n+1)Fn; m represents an integer of 1 to 10, and n represents an integer of 2 to (2m+1); and D represents a linking group (excluding an alkylene group) for connecting R1 and Si, or a single bond].