公开(公告)号：US20040188500A1

公开(公告)日：2004-09-30

申请号：US10708890

申请日：2004-03-30

Applicant: LITTON SYSTEMS, INC.

Inventor： Niels F. Jacksen ,  Michael J. Iosue ,  Miguel M. Saldana ,  Jay Scott Tucker

IPC: B23K020/00

CPC classification number: B23K20/16 ,  B23K20/023 ,  C04B37/04 ,  C04B2237/124 ,  C04B2237/125 ,  H01J31/507 ,  H01J43/246 ,  H01J2231/5016

Abstract: Mating faces of a microchannel plate (MCP) (50) and a multi-layer ceramic body (80) unit are deposited with a thin film having protuberances (84) using a suitable metal selected for optimum diffusion at a desired temperatures and pressure. The metallized MCP (50) and multi-layer ceramic body (80) unit are then aligned and placed in a bonding fixture (F) that provides the necessary force applied to the components to initiate a diffusion bond at a desired elevated temperature. The bonding fixture (F) is then placed in a vacuum heat chamber (V) to accelerate the diffusion bonding process between the MCP (50) and the multi-layer ceramic body unit (80).

Abstract translation: 微通道板（MCP）（50）和多层陶瓷体（80）单元的配合面使用在期望的温度和压力下选择用于最佳扩散的合适金属沉积具有突起（84）的薄膜。 金属化MCP（50）和多层陶瓷体（80）单元然后对准并放置在粘合夹具（F）中，其提供施加到部件上的必要的力以在期望的高温下引发扩散接合。 接合夹具（F）然后被放置在真空加热室（V）中，以加速MCP（50）和多层陶瓷体单元（80）之间的扩散接合过程。