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公开(公告)号：US20230062384A1
公开(公告)日：2023-03-02
申请号：US17797234
申请日：2021-01-05
Applicant: LS ELECTRIC CO., LTD.
Inventor： Seongeon KIM
IPC: H05K7/20
Abstract: Disclosed are a cooling plate and a manufacturing method therefor. The cooling plate according to an embodiment of the present invention comprises a cooling cover and a cooling body which has a cooling fluid accommodation portion formed therein and to which the cooling cover is coupled. The cooling cover is coupled to the cooling body so as to seal the cooling fluid accommodation portion. The cooling cover and the cooling body are coupled through friction stir welding. Thus, the cooling fluid accommodation portion can be reliably sealed.
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