专利检索 ap:("LTC CO., LTD.") AND inv:"JONGSOON LEE" 第 1 页

1.

发明申请
PEELING SOLUTION COMPOSITION FOR DRY FILM RESIST 审中-公开

公开(公告)号：US20200272056A1

公开(公告)日：2020-08-27

申请号：US16487905

申请日：2019-04-16

申请人： LTC CO., LTD.

发明人： HOSUNG CHOI , KYUSANG KIM , JONGIL BAE , JONGSOON LEE , SANGKU HA , YUNMO YANG

IPC分类号： G03F7/42 , C11D7/50 , C11D7/32 , C11D7/34

摘要： The present invention relates to a peeling solution composition for dry film resist, which is usable for manufacturing a PCB for forming a microcircuit, and particularly is applicable for a process of manufacturing a flexible multi-layer PCB.