公开(公告)号：US06444034B1

公开(公告)日：2002-09-03

申请号：US09569317

申请日：2000-05-11

申请人： Yi-Chang Hsieh ,  Lai-Fue Hsieh ,  Mu-Sheng Liao ,  Ching-Jung Huang

发明人： Yi-Chang Hsieh ,  Lai-Fue Hsieh ,  Mu-Sheng Liao ,  Ching-Jung Huang

IPC分类号： B05B5025

CPC分类号： H05F1/02 ,  B05B12/122 ,  B05B13/0221 ,  H01L21/6715 ,  H01L21/67259

摘要： An apparatus for preventing electrostatic destruction of integrated circuits coats an electrostatic agent on surfaces of the integrated circuits to avoid accumulation of static electricity caused by dynamic contact friction. The apparatus comprises a belt, at least one motor, at least one spray nozzle, at least one dispenser or controller and at least one photo switch. The integrated circuits are placed on the belt. The motor drives the belt and therefore the integrated circuits step by step to the spray nozzle to coat the electrostatic agent on the surfaces of the integrated circuits. The controller controls the output rate of the electrostatic agent from the spray nozzle. The photo switch is connected to the spray nozzle and dispenser to detect the integrated circuits as they pass the spray nozzle.

摘要翻译： 用于防止集成电路的静电破坏的装置在集成电路的表面上涂覆静电剂，以避免由动态接触摩擦引起的静电积聚。 该装置包括皮带，至少一个马达，至少一个喷嘴，至少一个分配器或控制器以及至少一个照片开关。 集成电路放在皮带上。 马达驱动皮带，因此将集成电路逐步驱动到喷嘴上以涂覆集成电路表面上的静电剂。 控制器控制来自喷嘴的静电剂的输出速率。 照相开关连接到喷嘴和分配器，以便在集成电路通过喷嘴时检测集成电路。

公开(公告)号：US06287071B1

公开(公告)日：2001-09-11

申请号：US09587429

申请日：2000-06-05

申请人： Lai-Fue Hsieh ,  Yi-Chang Hsieh ,  Ching-Jung Huang ,  Mu-Sheng Liao

发明人： Lai-Fue Hsieh ,  Yi-Chang Hsieh ,  Ching-Jung Huang ,  Mu-Sheng Liao

IPC分类号： B65G4791

CPC分类号： B65G47/917 ,  H05K13/0409

摘要： An apparatus is adapted for picking-up an integrated circuit component and is adapted to be connected to an air pump. The apparatus includes a retaining block formed with a first pipe hole and a washer receiving recess for receiving a washer. An air pipe is formed with a radially and outwardly extending rim flange at a junction of upper and lower pipe sections thereof. The lower pipe section extends sealingly through a second pipe hole in the washer and further through the first pipe hole such that the rim flange rests on top of the washer in the washer receiving recess, such that a distal lower end of the lower pipe section projects downwardly relative to the retaining block, and such that a distal upper end of the upper pipe section extends outwardly of the washer receiving recess and projects upwardly relative to the retaining block. A coupling base is mounted on top of the retaining block, and includes a horizontal base wall formed with a third pipe hole extending through top and bottom sides thereof and a spring receiving recess formed in the bottom side. A compression spring is sleeved around a guide tube that extends downwardly from the base wall and into the washer receiving recess. The compression spring has an upper spring portion disposed in the spring receiving recess, and a lower spring portion disposed in the washer receiving recess.

摘要翻译： 一种装置适用于拾取集成电路部件并适于连接到空气泵。 该装置包括形成有第一管孔的保持块和用于容纳垫圈的垫圈容纳凹部。 空气管在其上管段和下管段的接合处形成有径向和向外延伸的轮缘凸缘。 下管部分密封地延伸穿过垫圈中的第二管孔并且进一步穿过第一管孔，使得边缘凸缘搁置在垫圈容纳凹部中的垫圈的顶部上，使得下管段的远端下端突出 向下相对于保持块，并且使得上管部分的远端上端从垫圈容纳凹部向外延伸并相对于保持块向上突出。 联接基座安装在保持块的顶部，并且包括形成有延伸穿过其顶侧和底侧的第三管孔的水平底壁和形成在底侧的弹簧容纳凹部。 压缩弹簧围绕导向管套管，该引导管从底壁向下延伸并进入垫圈容纳凹部。 压缩弹簧具有设置在弹簧容纳凹部中的上弹簧部分和设置在垫圈容纳凹部中的下弹簧部分。

公开(公告)号：US06204676B1

公开(公告)日：2001-03-20

申请号：US09307964

申请日：1999-05-10

申请人： Yi-Chang Hsieh ,  Lai-Fue Hsieh ,  Mu-Sheng Liao

发明人： Yi-Chang Hsieh ,  Lai-Fue Hsieh ,  Mu-Sheng Liao

IPC分类号： G01R3102

CPC分类号： G01R1/0483 ,  G01R31/2851

摘要： A testing apparatus for testing a ball grid array (BGA) device, includes a movable carrier which has a top face recessed to form a cavity of square shape to receive the BGA device. A centering member is disposed at a center part of a cavity bottom face of the cavity to center a squarely looped array of voltage source solder balls formed at a bottom face of the BGA device, relative to the center part of the cavity bottom face. The centering member projects upward from the cavity bottom face to engage and prevent positional deviation of the squarely looped array of the voltage source solder balls when the BGA device is seated on the cavity bottom face. The testing apparatus further includes a testing circuit unit, a surface mount matrix disposed on top of the testing circuit unit, and a hollow frame member mounted on top of the surface mount matrix. The frame member has a square central opening to expose the surface mount matrix, and the surface mount matrix can make a direct electrical contact with the BGA device when the latter is placed in the central opening.

摘要翻译： 用于测试球栅阵列（BGA）装置的测试装置包括可移动的载体，其具有凹入的顶面以形成正方形的腔以接收BGA装置。 定心构件设置在空腔底面的中心部分，以使相对于空腔底面的中心部分形成在BGA装置的底面的电压源焊球的正方形环阵列居中。 定心构件从空腔底面向上突出，以便当BGA装置安置在空腔底面时，接合并防止电压源焊球的正方形环阵列的位置偏移。 测试装置还包括测试电路单元，设置在测试电路单元顶部的表面安装矩阵和安装在表面安装矩阵顶部上的中空框架构件。 框架构件具有方形的中央开口以暴露表面安装矩阵，并且当后者放置在中央开口中时，表面安装矩阵可以与BGA装置直接电接触。

公开(公告)号：US6075255A

公开(公告)日：2000-06-13

申请号：US152724

申请日：1998-09-14

申请人： Mu-Sheng Liao ,  Lai-Fue Hsieh ,  Yi-Chang Hsieh

发明人： Mu-Sheng Liao ,  Lai-Fue Hsieh ,  Yi-Chang Hsieh

IPC分类号： G01R1/04 ,  H01L21/461 ,  H01L21/469 ,  H01L23/58

CPC分类号： G01R1/0483

摘要： A contactor system is adapted for use when testing a ball grid array (BGA) device, and includes a conductive socket that is retained on a testing board and that establishes a ground connection therewith. The socket is formed with a receiving space adapted for receiving the BGA device therein. An insulating guide unit is mounted on the socket in the receiving space and is adapted to guide loading movement of the BGA device into the receiving space via an open top section of the latter and to prevent undesired electrical contact between the socket and the BGA device. A surface mount matrix is disposed on top of the testing board and is clamped between the socket and the testing board. The surface mount matrix is accessible via an open bottom section of the receiving space, and is adapted to contact solder balls on the BGA device directly so as to establish electrical connection between the BGA device and testing circuit layout on the testing board.

摘要翻译： 接触器系统适于在测试球栅阵列（BGA）装置时使用，并且包括保持在测试板上并与其建立接地连接的导电插座。 插座形成有适于在其中接收BGA器件的接收空间。 绝缘引导单元安装在容纳空间中的插座上，并且适于引导BGA装置经由后者的敞开的顶部部分进入容纳空间的装载运动，并且防止插座和BGA装置之间的不期望的电接触。 表面安装矩阵设置在测试板的顶部，并夹在插座和测试板之间。 表面安装矩阵可以通过接收空间的开放的底部部分接近，并且适于直接接触BGA器件上的焊球，以便在BGA器件与测试板上的测试电路布局之间建立电连接。

公开(公告)号：US07094068B2

公开(公告)日：2006-08-22

申请号：US10637588

申请日：2003-08-11

申请人： Ching-Jung Huang ,  Hsiu-Chu Chou ,  Mu-Sheng Liao ,  Fu-Tsai Chen ,  Pao-Chuan Kuo

发明人： Ching-Jung Huang ,  Hsiu-Chu Chou ,  Mu-Sheng Liao ,  Fu-Tsai Chen ,  Pao-Chuan Kuo

IPC分类号： H01R12/00

CPC分类号： H05K3/244 ,  G01R1/0408 ,  H05K3/325 ,  H05K2201/10689

摘要： A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC for testing connection, such as a quad flat packaged IC (QFP), a dual inline packaged IC (DIP) or a small outline packaged IC (SOP). The bonding pads on the load board connect the leads of the testing IC directly during IC testing, thus the conventional test socket between a conventional load board and a packaged IC is omitted.

摘要翻译： 用于封装IC测试的负载板。 其上具有预定测试电路的负载板在其表面上具有焊盘区域。 多个接合焊盘形成在接合焊盘区域上，每个接合焊盘区域对应于用于测试连接的封装IC的引线设置，例如四方扁平封装IC（QFP），双列直插封装IC（DIP）或 小型封装IC（SOP）。 负载板上的接合焊盘在IC测试期间直接连接测试IC的引线，因此省略了常规负载板和封装IC之间的常规测试插座。

公开(公告)号：US20050037638A1

公开(公告)日：2005-02-17

申请号：US10637588

申请日：2003-08-11

申请人： Ching-Jung Huang ,  Hsiu-Chu Chou ,  Mu-Sheng Liao ,  Fu-Tsai Chen ,  Pao-Chuan Kuo

发明人： Ching-Jung Huang ,  Hsiu-Chu Chou ,  Mu-Sheng Liao ,  Fu-Tsai Chen ,  Pao-Chuan Kuo

IPC分类号： G01R1/04 ,  H01R12/00 ,  H05K3/24 ,  H05K3/32

CPC分类号： H05K3/244 ,  G01R1/0408 ,  H05K3/325 ,  H05K2201/10689

摘要： A load board for packaged IC testing. The load board with predetermined testing circuit thereon has bonding pad areas on its surface. A plurality of bonding pads is formed on the bonding pad areas, each of which is disposed corresponding to a lead of a packaged IC for testing connection, such as a quad flat packaged IC (QFP), a dual inline packaged IC (DIP) or a small outline packaged IC (SOP). The bonding pads on the load board connect the leads of the testing IC directly during IC testing, thus the conventional test socket between a conventional load board and a packaged IC is omitted.

摘要翻译： 用于封装IC测试的负载板。 其上具有预定测试电路的负载板在其表面上具有焊盘区域。 多个接合焊盘形成在接合焊盘区域上，每个接合焊盘区域对应于用于测试连接的封装IC的引线设置，例如四方扁平封装IC（QFP），双列直插封装IC（DIP）或 小型封装IC（SOP）。 负载板上的接合焊盘在IC测试期间直接连接测试IC的引线，因此省略了常规负载板和封装IC之间的常规测试插座。

公开(公告)号：US06498505B2

公开(公告)日：2002-12-24

申请号：US09803465

申请日：2001-03-08

申请人： Mu-Sheng Liao ,  Wei-Feng Lin ,  Chen-Wen Tsai ,  Ching-Jung Huang

发明人： Mu-Sheng Liao ,  Wei-Feng Lin ,  Chen-Wen Tsai ,  Ching-Jung Huang

IPC分类号： G01R3102

CPC分类号： G01R1/0483

摘要： A testing jig for semiconductor components, mainly comprising a main jig body, wherein on its bottom is provided with a retrieving head. While on the center of the bottom of the retrieving head is provided with a concave space, around which is arranged a plurality of air holes which are connected with the internal airways and also connected with the air inlet on the top of the main body. Furthermore, on the bottom of the main jig body is provided with two buffer blocks on opposite sides, which can prevent the chip on the center of the base board from being contacted with external force or foreign objects in the process of retrieving the base board during testing.

摘要翻译： 一种用于半导体部件的测试夹具，主要包括主夹具本体，其底部设置有检索头。 而在回收头底部的中心设置有凹形空间，在该空间周围配置有与内部气道连接的多个气孔，并且还与主体顶部的空气入口连接。 此外，主夹具体的底部在相对侧设置有两个缓冲块，这可以防止在基板的中心处的芯片在检测基板的过程中与外力或异物接触 测试。