公开(公告)号：US20070090164A1

公开(公告)日：2007-04-26

申请号：US11567961

申请日：2006-12-07

申请人： Leandro Barajas ,  Magnus Egerstedt ,  Alex Goldstein ,  Edward Kamen

发明人： Leandro Barajas ,  Magnus Egerstedt ,  Alex Goldstein ,  Edward Kamen

IPC分类号： A47J36/02

CPC分类号： H05K3/1233 ,  H05K1/0269 ,  H05K3/3484 ,  H05K2203/0139 ,  H05K2203/1476 ,  H05K2203/163

摘要： Systems and methods for implementing hybrid, closed-loop control that generates control values for processes defined by a limited number of function evaluations and large amounts of process and measurement noise. The described control system is applied to a stencil printing process for applying solder paste to an electronic medium such as a printed circuit board or semiconductor wafer. The control system is defined by a hybrid approach. A first, coarse algorithm is used to rapidly produce the value of a stencil printer control value resulting in a solder paste deposit having a volume within predetermined acceptable limits. After the coarse algorithm no longer produces solder paste deposits closer to a desired volume, a second, more refined estimator is used to fine tune the process. An additional transitional algorithm may be added between the coarse algorithm and refined estimator. The coarse algorithm may be implemented with a constrained-conjugated gradient search, and the refined search may be a implemented using a least-squares affine estimator or a quadratic estimator. The transitional algorithm may be implemented using a block version of a least-squares affine estimator.

摘要翻译： 用于实现混合闭环控制的系统和方法，其产生由有限数量的功能评估和大量过程和测量噪声定义的过程的控制值。 将所述控制系统应用于用于将焊膏施加到诸如印刷电路板或半导体晶片的电子介质的模版印刷工艺。 控制系统由混合方法定义。 使用第一粗略算法来快速产生模板印刷机控制值的值，导致具有在预定可接受限度内的体积的焊膏沉积物。 在粗略算法不再产生更接近所需体积的焊膏沉积物之后，使用第二个更精细的估计器来微调该过程。 可以在粗略算法和精确估计器之间添加额外的过渡算法。 可以用约束共轭梯度搜索来实现粗略算法，并且精细搜索可以是使用最小平方仿射估计器或二次估计器来实现的。 可以使用最小平方仿射估计器的块版本来实现过渡算法。