公开(公告)号：US10111353B2

公开(公告)日：2018-10-23

申请号：US15433461

申请日：2017-02-15

Applicant: Lear Corporation

Inventor： Joan Ignasi Ferran Palau ,  Ramón Piñana López ,  Xavier Carbonell ,  Jose Gabriel Fernández Bañares ,  Enric Aparicio Rollan ,  Marcos Blanco Figueras

IPC: H05K5/00 ,  H05K7/14 ,  H02G3/08

Abstract: An unit housing includes a first housing member, a second housing member, a circuit board disposed at least partially between the first housing member and the second housing member, a positioning column disposed at least partially in the circuit board, a first resilient member connected to the positioning column between the circuit board and the first housing member, and a second resilient member connected to the positioning column between the circuit board and the second housing member.

公开(公告)号：US20170251565A1

公开(公告)日：2017-08-31

申请号：US15433461

申请日：2017-02-15

Applicant: Lear Corporation

Inventor： Joan I. Ferran, Palau ,  Ramon P. Lopez ,  Xavier Carbonell ,  Jose G. Fernandez, Banares ,  Enric A. Rollan ,  Marcos B. Figueras

IPC: H05K7/14 ,  H02G3/08

CPC classification number: H05K7/1417 ,  H02G3/08 ,  H05K5/006 ,  H05K7/142 ,  H05K7/1427

Abstract: An unit housing includes a first housing member, a second housing member, a circuit board disposed at least partially between the first housing member and the second housing member, a positioning column disposed at least partially in the circuit board, a first resilient member connected to the positioning column between the circuit board and the first housing member, and a second resilient member connected to the positioning column between the circuit board and the second housing member.