公开(公告)号：US20130201650A1

公开(公告)日：2013-08-08

申请号：US13449691

申请日：2012-04-18

申请人： Lee-Cheng SHEN ,  Tsung-Ying HSIEH

发明人： Lee-Cheng SHEN ,  Tsung-Ying HSIEH

IPC分类号： H05K9/00

CPC分类号： H05K9/0024

摘要： A molded radio-frequency (RF) structure with electromagnetic shielding includes a substrate layer, an RF layer, a molded layer and a metal layer. The RF element is disposed on the substrate layer. The molded layer is located on the substrate layer and overlays the RF element. The metal layer is coated on the molded layer, and has an opening located above the RF element.

摘要翻译： 具有电磁屏蔽的模制射频（RF）结构包括基底层，RF层，模制层和金属层。 RF元件设置在基板层上。 模制层位于衬底层上并覆盖RF元件。 金属层涂覆在模制层上，并且具有位于RF元件上方的开口。