ENCAPSULATED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING
    1.
    发明申请
    ENCAPSULATED ELECTRONIC DEVICE AND METHOD OF MANUFACTURING 审中-公开
    封装电子器件及其制造方法

    公开(公告)号:US20110171764A1

    公开(公告)日:2011-07-14

    申请号:US12867748

    申请日:2009-02-13

    IPC分类号: H01L51/56

    摘要: An encapsulated electronic device is described comprising: a first barrier structure (20) comprising at least one inorganic (24) and at least one organic layer (23), a second barrier structure (30) comprising at least one inorganic (31) and at least one organic layer (32), an electronic device (10) arranged between the first and the second barrier structure (20, 30), characterized in that the at least one inorganic layer (24) of the first barrier structure (20) and the at least one inorganic (31) layer of the second barrier structure (30) contact each outside an area (A) occupied by the electronic device (10).

    摘要翻译: 描述了一种封装的电子器件,其包括:包含至少一个无机物(24)和至少一个有机层(23)的第一阻挡结构(20),包含至少一种无机物(31)的第二阻挡结构(30) 至少一个有机层(32),布置在第一和第二阻挡结构(20,30)之间的电子器件(10),其特征在于,所述第一阻挡结构(20)的至少一个无机层(24)和 第二阻挡结构(30)的至少一个无机(31)层与电子设备(10)占据的区域(A)的每个外部接触。