公开(公告)号：US07172017B2

公开(公告)日：2007-02-06

申请号：US10339488

申请日：2003-01-10

申请人： Li-Kuang Tan ,  Yu-Hung Huang ,  Wei-Fan Wu ,  Kuo-Cheng Lin ,  Wen-Shi Huang

发明人： Li-Kuang Tan ,  Yu-Hung Huang ,  Wei-Fan Wu ,  Kuo-Cheng Lin ,  Wen-Shi Huang

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： This specification discloses a heat sink for coolers. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element is comprised of a heat conductive plate and a heat conductive block installed at the center thereof. The area of the lower surface of the heat conductive block is greater than that of the upper surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

摘要翻译： 本说明书公开了一种用于冷却器的散热器。 散热器包括导热元件，覆盖在导热元件上的散热壳，以及安装在散热壳上的多个散热片。 导热元件由导热板和安装在其中心的导热块组成。 导热块的下表面的面积大于其上表面的面积。 当导热板的下表面与需要散热的装置接触时，导热块增加了导热板中心处的导热体积，使得由该装置产生的热可以在 最佳速率。

公开(公告)号：US20070000643A1

公开(公告)日：2007-01-04

申请号：US11515786

申请日：2006-09-06

申请人： Li-Kuang Tan ,  Yu-Hung Huang ,  Wei-Fan Wu ,  Kuo-Cheng Lin ,  Wen-Shi Huang

发明人： Li-Kuang Tan ,  Yu-Hung Huang ,  Wei-Fan Wu ,  Kuo-Cheng Lin ,  Wen-Shi Huang

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for coolers is provided. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element includes a heat conductive plate and a heat conductive block installed at the center thereof. The area of the bottom surface of the heat conductive block is greater than that of the topmost surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

摘要翻译： 提供冷却器散热器。 散热器包括导热元件，覆盖在导热元件上的散热壳，以及安装在散热壳上的多个散热片。 导热元件包括导热板和安装在其中心的导热块。 导热块的底面的面积大于其最上表面的面积。 当导热板的下表面与需要散热的装置接触时，导热块增加了导热板中心处的导热体积，使得由该装置产生的热可以在 最佳速率。