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    Scalable Position-Sensitive Photodetector Device
    3.
    发明申请
    Scalable Position-Sensitive Photodetector Device 有权

    公开(公告)号：US20210066382A1

    公开(公告)日：2021-03-04

    申请号：US16557149

    申请日：2019-08-30

    Applicant: LightSpin Technologies Inc.

    Inventor： Eric Harmon

    IPC: H01L27/146 ,  H01L27/144 ,  H01L31/107

    Abstract: A position-sensitive photodetector device includes a grid of series-connected photodetectors that are electrically coupled to either a vertical photodetector array (VA photodetectors) or to a horizontal photodetector array (HA photodetectors). The VA and HA photodetectors are arranged in an alternating sequence along rows and/or columns throughout the grid. A horizontal-position readout line is electrically coupled to a termination of each vertical photodetector array, and a vertical-position readout line is electrically coupled to a termination of each horizontal photodetector array.

    Virtual Negative Bevel and Methods of Isolating Adjacent Devices
    5.
    发明申请
    Virtual Negative Bevel and Methods of Isolating Adjacent Devices 审中-公开

    公开(公告)号：US20190140128A1

    公开(公告)日：2019-05-09

    申请号：US15808605

    申请日：2017-11-09

    Applicant: LightSpin Technologies Inc.

    Inventor： Eric Harmon

    IPC: H01L31/107 ,  H01L31/02 ,  H01L31/18

    Abstract: This disclosure is directed to devices and systems and methods comprising virtual negative beveled facets including to isolate adjacent devices from one another. Aspects hereof are directed to integrated photon detectors or photodetector devices incorporating implant isolation mesas and resistors, and in particular to methods and structures for isolating such detectors or devices from neighboring detectors or devices.

    Integrated avalanche photodiode arrays
    6.
    发明授权
    Integrated avalanche photodiode arrays 有权

    公开(公告)号：US09768211B2

    公开(公告)日：2017-09-19

    申请号：US14705270

    申请日：2015-05-06

    Applicant: LightSpin Technologies, Inc.

    Inventor： Eric Harmon

    IPC: H01L27/14 ,  H01L27/144 ,  H01L31/00

    CPC classification number: H01L27/1446 ,  H01L31/00 ,  H01L31/107

    Abstract: A photodetector includes an array of pixels, each pixel comprising a defined doped region defined in a doped semiconductor layer. The defined doped region is defined by selected regions of ion implants to provide resistive isolation between each defined doped region. A capacitor is formed by the defined doped region and a metal layer disposed above the doped semiconductor layer. A contact metal line is disposed above the doped semiconductor layer. The capacitor metal and contact metal lines are electrically coupled together and are in electrical communication with the output of the photodetector array.

    Scalable position-sensitive photodetector device
    8.
    发明授权
    Scalable position-sensitive photodetector device 有权

    公开(公告)号：US11264422B2

    公开(公告)日：2022-03-01

    申请号：US16557149

    申请日：2019-08-30

    Applicant: LightSpin Technologies Inc.

    Inventor： Eric Harmon

    IPC: H01L27/146 ,  H01L27/144 ,  H01L31/107

    Abstract: A position-sensitive photodetector device includes a grid of series-connected photodetectors that are electrically coupled to either a vertical photodetector array (VA photodetectors) or to a horizontal photodetector array (HA photodetectors). The VA and HA photodetectors are arranged in an alternating sequence along rows and/or columns throughout the grid. A horizontal-position readout line is electrically coupled to a termination of each vertical photodetector array, and a vertical-position readout line is electrically coupled to a termination of each horizontal photodetector array.

    MODULAR PET DETECTOR
    9.
    发明申请
    MODULAR PET DETECTOR 有权

    公开(公告)号：US20210223414A1

    公开(公告)日：2021-07-22

    申请号：US17154217

    申请日：2021-01-21

    Applicant: LightSpin Technologies Inc.

    Inventor： Eric Harmon

    IPC: G01T1/20

    Abstract: A gamma-ray detector includes a plurality of modular one-dimensional arrays of monolithic detector sub-modules. Each monolithic detector sub-module includes a scintillator layer, a light-spreading layer, and a photodetector layer. The photodetector layer comprises a two-dimensional array of photodetectors that are arranged in columns and rows. A common printed circuit board is electrically coupled to the photodetectors of the monolithic detector sub-modules of a corresponding modular one-dimensional array. The photodetectors can be electrically coupled in a split-row configuration or in a checkerboard configuration. The photodetectors can also have a differential readout.

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