公开(公告)号：US20240103219A1

公开(公告)日：2024-03-28

申请号：US18526652

申请日：2023-12-01

申请人： Lightmatter, Inc.

发明人： Nicholas C. Harris ,  Carl Ramey ,  Michael Gould ,  Thomas Graham ,  Darius Bunandar ,  Ryan Braid ,  Mykhailo Tymchenko

IPC分类号： G02B6/122 ,  G02B6/12 ,  G02B6/13 ,  G02B6/136 ,  H01L21/027

CPC分类号： G02B6/1225 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/13 ,  G02B6/136 ,  H01L21/0275 ,  H04J14/02

摘要： Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

公开(公告)号：US20240219635A1

公开(公告)日：2024-07-04

申请号：US18606188

申请日：2024-03-15

申请人： Lightmatter, Inc.

发明人： Nicholas C. Harris ,  Carl Ramey ,  Michael Gould ,  Thomas Graham ,  Darius Bunandar ,  Ryan Braid ,  Mykhailo Tymchenko

IPC分类号： G02B6/122 ,  G02B6/12 ,  G02B6/13 ,  G02B6/136 ,  H01L21/027 ,  H04J14/02

CPC分类号： G02B6/1225 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/13 ,  G02B6/136 ,  H01L21/0275 ,  H04J14/02

摘要： Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

公开(公告)号：US11860413B2

公开(公告)日：2024-01-02

申请号：US18070889

申请日：2022-11-29

申请人： Lightmatter, Inc.

发明人： Nicholas C. Harris ,  Carl Ramey ,  Michael Gould ,  Thomas Graham ,  Darius Bunandar ,  Ryan Braid ,  Mykhailo Tymchenko

IPC分类号： G02B6/13 ,  G02B6/122 ,  G02B6/12 ,  H01L21/027 ,  G02B6/136 ,  H04J14/02

CPC分类号： G02B6/1225 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/13 ,  G02B6/136 ,  H01L21/0275 ,  H04J14/02

摘要： Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

公开(公告)号：US11754783B2

公开(公告)日：2023-09-12

申请号：US17313415

申请日：2021-05-06

申请人： Lightmatter, Inc.

发明人： Nicholas C. Harris ,  Carl Ramey ,  Michael Gould ,  Thomas Graham ,  Darius Bunandar ,  Ryan Braid ,  Mykhailo Tymchenko

IPC分类号： G02B6/12 ,  G02B6/122 ,  H01L21/027 ,  G02B6/13 ,  G02B6/136 ,  H04J14/02

CPC分类号： G02B6/1225 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/13 ,  G02B6/136 ,  H01L21/0275 ,  H04J14/02

摘要： Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

公开(公告)号：US12124081B2

公开(公告)日：2024-10-22

申请号：US18356680

申请日：2023-07-21

申请人： Lightmatter, Inc.

发明人： Nicholas C. Harris ,  Carl Ramey ,  Michael Gould ,  Thomas Graham ,  Darius Bunandar ,  Ryan Braid ,  Mykhailo Tymchenko

IPC分类号： G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/136 ,  H01L21/027 ,  H04J14/02

CPC分类号： G02B6/1225 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/13 ,  G02B6/136 ,  H01L21/0275 ,  H04J14/02

摘要： Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

公开(公告)号：US12092867B2

公开(公告)日：2024-09-17

申请号：US18526714

申请日：2023-12-01

申请人： Lightmatter, Inc.

发明人： Nicholas C. Harris ,  Carl Ramey ,  Michael Gould ,  Thomas Graham ,  Darius Bunandar ,  Ryan Braid ,  Mykhailo Tymchenko

IPC分类号： G02B6/13 ,  G02B6/12 ,  G02B6/122 ,  G02B6/136 ,  H01L21/027 ,  H04J14/02

CPC分类号： G02B6/1225 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/13 ,  G02B6/136 ,  H01L21/0275 ,  H04J14/02

摘要： Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

公开(公告)号：US12038604B2

公开(公告)日：2024-07-16

申请号：US18526652

申请日：2023-12-01

申请人： Lightmatter, Inc.

发明人： Nicholas C. Harris ,  Carl Ramey ,  Michael Gould ,  Thomas Graham ,  Darius Bunandar ,  Ryan Braid ,  Mykhailo Tymchenko

IPC分类号： G02B6/12 ,  G02B6/122 ,  G02B6/13 ,  G02B6/136 ,  H01L21/027 ,  H04J14/02

CPC分类号： G02B6/1225 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/13 ,  G02B6/136 ,  H01L21/0275 ,  H04J14/02

摘要： Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

公开(公告)号：US20210278590A1

公开(公告)日：2021-09-09

申请号：US17313415

申请日：2021-05-06

申请人： Lightmatter, Inc.

发明人： Nicholas C. Harris ,  Carl Ramey ,  Michael Gould ,  Thomas Graham ,  Darius Bunandar ,  Ryan Braid ,  Mykhailo Tymchenko

IPC分类号： G02B6/122 ,  G02B6/12 ,  H01L21/027 ,  G02B6/13 ,  G02B6/136

摘要： Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

公开(公告)号：US12124082B2

公开(公告)日：2024-10-22

申请号：US18455235

申请日：2023-08-24

申请人： Lightmatter, Inc.

发明人： Nicholas C. Harris ,  Carl Ramey ,  Michael Gould ,  Thomas Graham ,  Darius Bunandar ,  Ryan Braid ,  Mykhailo Tymchenko

IPC分类号： G02B6/122 ,  G02B6/12 ,  G02B6/13 ,  G02B6/136 ,  H01L21/027 ,  H04J14/02

CPC分类号： G02B6/1225 ,  G02B6/12004 ,  G02B6/12007 ,  G02B6/13 ,  G02B6/136 ,  H01L21/0275 ,  H04J14/02

摘要： Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.

公开(公告)号：US20230358957A1

公开(公告)日：2023-11-09

申请号：US18356680

申请日：2023-07-21

申请人： Lightmatter, Inc.

发明人： Nicholas C. Harris ,  Carl Ramey ,  Michael Gould ,  Thomas Graham ,  Darius Bunandar ,  Ryan Braid ,  Mykhailo Tymchenko

IPC分类号： G02B6/122 ,  G02B6/12 ,  H01L21/027 ,  G02B6/13 ,  G02B6/136

CPC分类号： G02B6/1225 ,  G02B6/12004 ,  H01L21/0275 ,  G02B6/13 ,  G02B6/12007 ,  G02B6/136 ,  H04J14/02

摘要： Described herein are photonic communication platforms that can overcome the memory bottleneck problem, thereby enabling scaling of memory capacity and bandwidth well beyond what is possible with conventional computing systems. Some embodiments provide photonic communication platforms that involve use of photonic modules. Each photonic module includes programmable photonic circuits for placing the module in optical communication with other modules based on the needs of a particular application. The architecture developed by the inventors relies on the use of common photomask sets (or at least one common photomask) to fabricate multiple photonic modules in a single wafer. Photonic modules in multiple wafers can be linked together into a communication platform using optical or electronic means.