公开(公告)号：US20240363478A1

公开(公告)日：2024-10-31

申请号：US18141118

申请日：2023-04-28

申请人： Littelfuse, Inc.

发明人： Aalok Bhatt ,  FRANCOIS PERRAUD ,  CYNTHIA SELKE ,  RHODRI HUGHES ,  TIBURCIO MALDO

IPC分类号： H01L23/373 ,  H01L23/31

CPC分类号： H01L23/3735 ,  H01L23/3107

摘要： A substrate package arrangement may include a substrate that contains a ceramic body, a top metal layer, disposed on a top side of the ceramic body, and a bottom metal layer, disposed on a bottom side of the ceramic body, opposite the top surface. The substrate package arrangement may further include a lead structure, electrically connected to the top metal layer, and being electrically isolated from the bottom metal layer, wherein the substrate and lead structure are arranged in a discrete package, and wherein the ceramic body is formed of a high thermal conductivity material.