公开(公告)号：US20240365039A1

公开(公告)日：2024-10-31

申请号：US18139877

申请日：2023-04-26

Applicant: Logitech Europe S.A.

Inventor： Daniel Ryan MARQUEZ ,  WeiJen CHENG ,  Hungl WU

IPC: H04R1/10

CPC classification number: H04R1/1008 ,  H04R1/1058

Abstract: A low profile acoustic module is described. Embodiments include a headset acoustic module having first and second chambers. The first chamber has a side wall and first portion of a back wall, and defining a first volume. The side wall defines an opening sized to retain a speaker, and the first chamber defines a first volume. The second chamber is adjacent the first chamber, and comprises an inner wall, a front wall, and a second portion of the back wall, and defining a second volume greater than the first volume. The second volume is fluidly coupled to the first volume via a first set of vents on the inner wall, the second volume is fluidly coupled to an ambient atmosphere via a second set of vents, and the inner wall comprises at least a portion of the side wall.