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公开(公告)号:US20210363390A1
公开(公告)日:2021-11-25
申请号:US17040689
申请日:2018-03-23
摘要: A pressure-sensitive structural adhesive film based on an epoxy resin composition, the epoxy resin composition having latent reactive, thermally activatable curing agent for producing a structural composite after thermal curing. The epoxy resin composition also comprises a curing agent that crosslinks at room temperature.