-
1.
公开(公告)号:US20240206062A1
公开(公告)日:2024-06-20
申请号:US18565613
申请日:2022-06-27
发明人: Chang Yol YANG , Won Jin BEOM , Hyung Cheol KIM , Kideok SONG
CPC分类号: H05K1/09 , H05K3/062 , H05K2201/0338 , H05K2201/0344 , H05K2201/0355 , H05K2203/0323 , H05K2203/0353 , H05K2203/0384
摘要: Disclosed are an ultra-thin copper foil with a carrier foil and a method for manufacturing an embedded substrate by using the same, the ultra-thin copper foil with a carrier foil including: a carrier foil; a non-etching release layer on the carrier foil; a first ultra-thin copper foil layer on the non-etching release layer; an etch stop layer on the first ultra-thin copper foil layer; and a second ultra-thin copper foil layer on the etch stop layer.