公开(公告)号：US20220278496A1

公开(公告)日：2022-09-01

申请号：US17663479

申请日：2022-05-16

Applicant: Lumentum Operations LLC

Inventor： Christoffer STROEMBERG ,  Susan FUNG ,  Derek A. TUCKER

IPC: H01S3/04 ,  H05K5/06 ,  H01S3/16 ,  H01S3/06 ,  H01S3/067 ,  H01S5/02 ,  H01S3/02 ,  H01S5/50

Abstract: An amplifier assembly may include a first heat sink plate that includes a first channel, a second heat sink plate that includes a second channel, and an amplifier rod disposed in the first channel and the second channel. The second heat sink plate may be connected with the first heat sink plate such that the first channel and the second channel align. The amplifier rod may be connected to the first heat sink plate and the second heat sink plate by a non-eutectic solder.

公开(公告)号：US20230129060A1

公开(公告)日：2023-04-27

申请号：US17646395

申请日：2021-12-29

Applicant: Lumentum Operations LLC

Inventor： Christoffer STROEMBERG ,  Connor BENTON ,  Alba FORNELLS VERNET

IPC: H01S3/042 ,  H01S3/02 ,  H01S3/16 ,  H01S3/04

Abstract: A heat sink assembly may include an alignment body with an opening configured to receive a crystal rod, wherein the opening is configured to maintain a crystalline orientation of the crystal rod relative to a physical orientation of the alignment body. The heat sink assembly may include a first cooling stack, wherein the first cooling stack includes a first cutout to receive the crystal rod and the alignment body. The heat sink assembly may include a second cooling stack, wherein the second cooling stack includes a second cutout to receive the crystal rod and the alignment body, and wherein the first cooling stack and the second cooling stack are configured to mate and at least partially sandwich the crystal rod and the alignment body.

公开(公告)号：US20230120272A1

公开(公告)日：2023-04-20

申请号：US17646396

申请日：2021-12-29

Applicant: Lumentum Operations LLC

Inventor： Christoffer STROEMBERG

IPC: H01S3/04 ,  H01S3/042 ,  H01S3/16 ,  H01S3/06

Abstract: A heat sink assembly may include a first cooling stack. The first cooling stack may include a silver-diamond composite material. The heat sink assembly may include a second cooling stack. The second cooling stack may include the silver-diamond composite material. The heat sink assembly may include a crystal rod. The crystal rod may be an ytterbium-doped, yttrium-aluminum-garnet laser medium. The crystal rod may be at least partially sandwiched by the first cooling stack and the second cooling stack.