公开(公告)号：US11349274B2

公开(公告)日：2022-05-31

申请号：US16588708

申请日：2019-09-30

Applicant: Lumentum Operations LLC

Inventor： Christoffer Stroemberg ,  Susan Fung ,  Derek A. Tucker

IPC: H01S3/04 ,  H05K5/06 ,  H01S3/16 ,  H01S3/06 ,  H01S3/067 ,  H01S5/02 ,  H01S3/02 ,  H01S5/50

Abstract: An amplifier assembly may include a first heat sink plate that includes a first channel, a second heat sink plate that includes a second channel, and an amplifier rod disposed in the first channel and the second channel. The second heat sink plate may be connected with the first heat sink plate such that the first channel and the second channel align. The amplifier rod may be connected to the first heat sink plate and the second heat sink plate by a non-eutectic solder.

公开(公告)号：US11894651B2

公开(公告)日：2024-02-06

申请号：US17663479

申请日：2022-05-16

Applicant: Lumentum Operations LLC

Inventor： Christoffer Stroemberg ,  Susan Fung ,  Derek A. Tucker

IPC: H01S3/04 ,  H05K5/06 ,  H01S3/16 ,  H01S3/06 ,  H01S3/067 ,  H01S5/02 ,  H01S3/02 ,  H01S5/50

CPC classification number: H01S3/0405 ,  H01S3/025 ,  H01S3/061 ,  H01S3/0615 ,  H01S3/0623 ,  H01S3/06754 ,  H01S3/1643 ,  H01S5/0216 ,  H01S5/50 ,  H05K5/06

Abstract: An amplifier assembly may include a first heat sink plate that includes a first channel, a second heat sink plate that includes a second channel, and an amplifier rod disposed in the first channel and the second channel. The second heat sink plate may be connected with the first heat sink plate such that the first channel and the second channel align. The amplifier rod may be connected to the first heat sink plate and the second heat sink plate by a non-eutectic solder.