公开(公告)号：US20250105184A1

公开(公告)日：2025-03-27

申请号：US18883834

申请日：2024-09-12

Applicant: MEDIATEK INC.

Inventor： Kai-Lun KUO ,  Kun-Ting TSAI ,  Che-Hung KUO

IPC: H01L23/00 ,  H01L23/48 ,  H01L23/528

Abstract: An electronic device is provided. The electronic device includes a semiconductor die. The semiconductor die has a first region of a first functional cell close to the peripheral edge of the semiconductor die. The semiconductor die includes a semiconductor substrate, a first signal bump, and a first power bump. The first signal bump and the first power bump are disposed on opposite surfaces of the semiconductor substrate and electrically connected to the first functional cell. The first signal bump and the first power bump both overlap the first region.