公开(公告)号：US20230173764A1

公开(公告)日：2023-06-08

申请号：US17545317

申请日：2021-12-08

Applicant: MEDTRONIC INC.

Inventor： CHRISTIAN S. NIELSEN ,  Sean Chen ,  Kasyap V. Kasyap Seethamraju

IPC: B29C65/60 ,  A61N1/375 ,  B29C65/18 ,  B29C65/00

CPC classification number: B29C65/601 ,  A61N1/37518 ,  B29C65/18 ,  B29C66/7292 ,  B29L2031/7534

Abstract: A method of forming an implant includes positioning a first mesh component of the implant within a second mesh component of the implant to form an implant assembly. The implant assembly is manipulated to join the first mesh component with the second mesh component.

公开(公告)号：US20220211477A1

公开(公告)日：2022-07-07

申请号：US17142682

申请日：2021-01-06

Applicant: MEDTRONIC INC.

Inventor： CHRISTIAN S. NIELSEN ,  Raman Bahulekar

IPC: A61F2/00 ,  A61L31/10 ,  A61L31/16

Abstract: A method of manufacturing a surgical device including providing a substrate having opposite first and second sides. Coupling a substrate to the plate such that the first side faces the plate and spraying a coating onto the second side.