公开(公告)号：US20210373091A1

公开(公告)日：2021-12-02

申请号：US16963352

申请日：2019-01-22

Applicant: MELEXIS TECHNOLOGIES SA

Inventor： Vincent HILIGSMANN ,  Wolfram KLUGE ,  David IHLE ,  Jian CHEN ,  Jorg RUDIGER ,  Sascha BEYER

IPC: G01R33/00 ,  G01R33/04 ,  G01D5/20

Abstract: A sensor package comprises a non-conductive substrate, at least two electrically conductive coils located at a first side of the non-conductive substrate, an evaluation circuit located at a second side of the non-conductive substrate opposing the first side of the non-conductive substrate and conductive connections between the at least two electrically conductive coils and the evaluation circuit.