公开(公告)号：US20250126742A1

公开(公告)日：2025-04-17

申请号：US18485368

申请日：2023-10-12

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Adi Yekutiel ,  Haim Kupershmidt

IPC: H05K7/20

Abstract: An apparatus includes an interface and a processor. The interface is configured to receive measurements of a first temperature of an integrated circuit (IC), and a second temperature of air in a case that surrounds the IC. The processor is configured to: (a) estimate a thermal resistance between the IC and the air, and (b) estimate, based on (i) the thermal resistance between the IC and the air, and (ii) the first and second temperatures, a flow rate of the air flowing through the case for dissipating heat generated by the IC.