公开(公告)号：US20130221456A1

公开(公告)日：2013-08-29

申请号：US13771023

申请日：2013-02-19

申请人： MEMSENSING MICROSYSTEMS TECHNOLOGY CO.,LTD.

发明人： Gang Li ,  Wei Hu ,  Jia-Xin Mei

IPC分类号： B81C1/00 ,  B81B3/00

CPC分类号： B81C1/00158 ,  B81B3/0018 ,  H04R19/005 ,  H04R31/006

摘要： A capacitance type micro-silicon microphone includes a base, a backplate and a diaphragm positioned above the backplate in a suspended manner. The base includes a top face, a bottom face and a number of sound bores recessing inwardly from the top face. Bottom sides of the sound bores are in communication with each other so as to form an upper cavity. The base defines at least one lower cavity recessing inwardly from the bottom face. The backplate is positioned above the upper cavity in a suspended manner. The lower cavity is in communication with the upper cavity so as to jointly form a back cavity of the capacitance type micro-silicon microphone. Besides, a method for fabricating the capacitance type micro-silicon microphone is also disclosed.

摘要翻译： 电容型微硅麦克风包括底座，背板和以悬挂方式定位在背板上方的隔膜。 基座包括顶面，底面和从顶面向内凹陷的多个声孔。 声孔的底侧彼此连通，以便形成上腔。 底座限定了从底面向内凹入的至少一个下腔体。 背板以悬挂的方式定位在上腔体上方。 下腔与上腔连通，共同形成电容式微硅麦克风的后腔。 此外，还公开了一种用于制造电容式微硅麦克风的方法。