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公开(公告)号：US11799220B2
公开(公告)日：2023-10-24
申请号：US17324817
申请日：2021-05-19
Inventor： Chung-Hsing Chang
IPC: H01R12/70
CPC classification number: H01R12/7076
Abstract: A redriver chip comprising: pre-stage transmission pin sets, pre-stage reception pin sets, post-stage transmission pin sets, post-stage reception pin sets and selectors. The pre-stage transmission pin sets and the pre-stage reception pin sets are disposed in alternating arrangement, and the post-stage transmission pin sets and the post-stage reception pin sets are disposed in alternating arrangement. The amount of the post-stage transmission pin sets is an integral multiple of the amount of pre-stage reception pin sets, and the amount of the pre-stage reception pin sets is an integral multiple of the pre-stage transmission pin sets. Each of the selectors is connected to one of the pre-stage reception pin sets and integral multiple amount of the post-stage transmission pin sets, or is connected to one of the pre-stage transmission pin sets and integral multiple amount of the post-stage reception pin sets.
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公开(公告)号：US11251697B1
公开(公告)日：2022-02-15
申请号：US17153743
申请日：2021-01-20
Inventor： Kai-Chieh Chiu , Ming-Chih Lo , Chung-Hsing Chang
Abstract: A power converting device for power supply comprises an input port, a voltage boost circuit and an output port. Input port has an input standby pin configured to transmit a first power signal having a first voltage value and an input power pin configured to transmit a second power signal having a second voltage value. Voltage boost circuit electrically connecting to the input standby pin and receives and converts the first power signal having the first voltage value into the first power signal having the second voltage value. Output port has an output standby pin electrically connecting to the voltage boost circuit to receive the first power signal having the second voltage value and an output power pin electrically connecting to the input power pin to receive the second power signal having the second voltage value, wherein the second voltage value is higher than the first voltage value.
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公开(公告)号：US11742603B2
公开(公告)日：2023-08-29
申请号：US17362136
申请日：2021-06-29
Inventor： Tung-Yi Tsai , Chung-Hsing Chang , Kuo-Wei Lu
CPC classification number: H01R12/732
Abstract: An input/output transmission interface assembly capable of being assembled on a motherboard includes a first transmission interface, a board-to-board connector, and a second transmission interface. The first transmission interface includes a first circuit board, a first electrical connector, a driving chip, and a plug portion. The plug portion is at one side of the first circuit board for being plugged into the motherboard. The second transmission interface includes a second circuit board and a second electrical connector. The second circuit board is substantially parallel to the first circuit board. The board-to-board connector is assembled on and between the first circuit board and the second circuit board. The first circuit board and the second circuit board are electrically connected with each other through the board-to-board connector.
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公开(公告)号：US20220255253A1
公开(公告)日：2022-08-11
申请号：US17362136
申请日：2021-06-29
Inventor： Tung-Yi Tsai , Chung-Hsing Chang , Kuo-Wei Lu
IPC: H01R12/73
Abstract: An input/output transmission interface assembly capable of being assembled on a motherboard includes a first transmission interface, a board-to-board connector, and a second transmission interface. The first transmission interface includes a first circuit board, a first electrical connector, a driving chip, and a plug portion. The plug portion is at one side of the first circuit board for being plugged into the motherboard. The second transmission interface includes a second circuit board and a second electrical connector. The second circuit board is substantially parallel to the first circuit board. The board-to-board connector is assembled on and between the first circuit board and the second circuit board. The first circuit board and the second circuit board are electrically connected with each other through the board-to-board connector.
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