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1.发明申请公开(公告)号：US20180294372A1
公开(公告)日：2018-10-11
申请号：US15947683
申请日：2018-04-06
Applicant: MICROLINK DEVICES, INC.
Inventor： Christopher Youtsey , Rekha Reddy , Christopher Stender
IPC: H01L31/0463 , H01L31/05 , H01L31/048
Abstract: Systems and methods taught herein provide thin film semiconductor devices such as thin film photovoltaic devices having via holes that enable electrical connection with a bottom surface of a topside contact of the thin film semiconductor device via the back side of the device (e.g., during mounting of the device). In some embodiments, the via holes are electrically insulated.
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