公开(公告)号：US20220257260A1

公开(公告)日：2022-08-18

申请号：US17550085

申请日：2021-12-14

Applicant: MICROVENTION, INC.

Inventor： Todd Hewitt ,  Joseph Emery ,  Hung Tran ,  John Vu ,  Karishma Desai ,  Parker Milhous

IPC: A61B17/12

Abstract: Devices and methods for treatment of a patient's vasculature are described. Embodiments may include an implant having multiple mesh layers. A first and second layer of the implant may be formed by folding over a single mesh and the third layer may be formed from a different mesh. The first, second, and third layers may be either a stasis or a structural layer and may be arranged in different orders. Embodiments may also include structures to assist in the expansion of the device. These structures may include an expandable loop or reinforcing finger extensions. Embodiments may also include a corrugation or ridge around a middle section of the implant to assist in deployment.