公开(公告)号：US20230217559A1

公开(公告)日：2023-07-06

申请号：US17798446

申请日：2021-02-10

Applicant: MICROWAVE CHEMICAL CO., LTD.

Inventor： Yasunori TSUKAHARA ,  Hisao WATANABE ,  Ryuhei KINJO ,  Kazushi UEMURA ,  Masahiro KANNO

IPC: H05B6/72 ,  H05B6/70

CPC classification number: H05B6/72 ,  H05B6/707

Abstract: Provided is a microwave processing apparatus that can irradiate an object with microwaves more uniformly. A microwave processing apparatus 1 includes a cavity that has a cylinder-like shape, and includes an internal space for accommodating an object, the cavity being provided with a microwave passage area in a partial region in an axial direction; a microwave generator; a rotary member that is provided on an outer circumferential side of the cavity so as to be rotatable, and includes, on an outer circumferential side of the microwave passage area, a cylinder-like member having a plurality of areas through which microwaves can pass; and a cover member that is provided while covering the entire cylinder-like member in a circumferential direction, and forms, on an outer circumferential side of the cylinder-like member, a wave guidepath for the microwaves introduced from the microwave generator.