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1.发明公开公开(公告)号：US20240174510A1
公开(公告)日：2024-05-30
申请号：US18436381
申请日：2024-02-08
Applicant: MIRRORCLE TECHNOLOGIES, INC.
Inventor： Stefan Richter , Johannes Kindt , Veljko Milanovic
CPC classification number: B81B3/0078 , H02N1/008 , B81B2201/04 , B81B2203/0154 , B81B2203/058
Abstract: A microelectromechanical system (MEMS) device comprising a wafer including a MEMS device in a substrate of the wafer is mounted to a fluid dispenser stage. The MEMS device has a damping structure coupled to a suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to the fixed part of the substrate. The damping structure extends into a gap between the suspended element and fixed part of the substrate. The fluid confinement structures permit movement of the damping structure within a limited portion of the gap and confine a viscoelastic fluid to the limited portion of the gap. A viscoelastic fluid is deposited onto the wafer in an area of the wafer configured to communicate the viscoelastic fluid into the limited portion of the gap.
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2.发明公开公开(公告)号：US20240174509A1
公开(公告)日：2024-05-30
申请号：US18436373
申请日：2024-02-08
Applicant: MIRRORCLE TECHNOLOGIES, INC.
Inventor： Stefan Richter , Johannes Kindt , Veljko Milanovic
CPC classification number: B81B3/0078 , H02N1/008 , B81B2201/04 , B81B2203/0154 , B81B2203/058
Abstract: A microelectromechanical system (MEMS) device includes a substrate, a suspended element and a damping structure connected to the suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to a fixed part of the substrate. The damping structure extends into a gap between the suspended element and the fixed part of the substrate. The damping structure includes one or more winglets that protrude over a recessed portion of the fixed part of the substrate. The fluid confinement structures are formed by the recessed portion of the fixed substrate and are configured to permit movement of the damping structure over the recessed portion of the substrate and confine a viscoelastic fluid to the limited portion of the gap underneath the winglets.
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Patent Agency Ranking
3.发明授权公开(公告)号：US12215020B2
公开(公告)日：2025-02-04
申请号：US18436373
申请日：2024-02-08
Applicant: MIRRORCLE TECHNOLOGIES, INC.
Inventor： Stefan Richter , Johannes Kindt , Veljko Milanovic
Abstract: A microelectromechanical system (MEMS) device includes a substrate, a suspended element and a damping structure connected to the suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to a fixed part of the substrate. The damping structure extends into a gap between the suspended element and the fixed part of the substrate. The damping structure includes one or more winglets that protrude over a recessed portion of the fixed part of the substrate. The fluid confinement structures are formed by the recessed portion of the fixed substrate and are configured to permit movement of the damping structure over the recessed portion of the substrate and confine a viscoelastic fluid to the limited portion of the gap underneath the winglets.
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4.发明公开公开(公告)号：US20230399224A1
公开(公告)日：2023-12-14
申请号：US18238021
申请日：2023-08-25
Applicant: Mirrorcle Technologies, Inc.
Inventor： Stefan Richter , Johannes Kindt , Veljko Milanovic
CPC classification number: B81B3/0078 , H02N1/008 , B81B2201/04 , B81B2203/0154 , B81B2203/058
Abstract: MEMS devices include a suspended element connected to a fixed part of a substrate by one or more flexures, wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate. A sensor coupled to the suspended element and a damping structure coupled to the suspended element extends into a gap between the suspended element and the fixed part of the substrate. One or more fluid confinement structures are configured to permit movement of the damping structure within a limited portion of the gap and to confine a viscoelastic fluid to the limited portion of the gap.
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5.发明授权公开(公告)号：US12195326B2
公开(公告)日：2025-01-14
申请号：US18436381
申请日：2024-02-08
Applicant: MIRRORCLE TECHNOLOGIES, INC.
Inventor： Stefan Richter , Johannes Kindt , Veljko Milanovic
Abstract: A microelectromechanical system (MEMS) device comprising a wafer including a MEMS device in a substrate of the wafer is mounted to a fluid dispenser stage. The MEMS device has a damping structure coupled to a suspended element and one or more fluid confinement structures. The suspended element is connected to a fixed part of the substrate by one or more flexures configured to permit movement of the suspended element relative to the fixed part of the substrate. The damping structure extends into a gap between the suspended element and fixed part of the substrate. The fluid confinement structures permit movement of the damping structure within a limited portion of the gap and confine a viscoelastic fluid to the limited portion of the gap. A viscoelastic fluid is deposited onto the wafer in an area of the wafer configured to communicate the viscoelastic fluid into the limited portion of the gap.
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公开(公告)号：US11772959B2
公开(公告)日：2023-10-03
申请号：US17940770
申请日：2022-09-08
Applicant: Mirrorcle Technologies, Inc.
Inventor： Stefan Richter , Johannes Kindt , Veljko Milanovic
CPC classification number: B81B3/0078 , H02N1/008 , B81B2201/04 , B81B2203/0154 , B81B2203/058
Abstract: MEMS devices include a suspended element connected to a fixed part of a substrate by one or more flexures, wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate. An actuator coupled to the suspended element and a damping structure coupled to the suspended element extends into a gap between the suspended element and the fixed part of the substrate. One or more fluid confinement structures are configured to permit movement of the damping structure within a limited portion of the gap and to confine a viscoelastic fluid to the limited portion of the gap.
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公开(公告)号：US12116268B2
公开(公告)日：2024-10-15
申请号：US18238021
申请日：2023-08-25
Applicant: Mirrorcle Technologies, Inc.
Inventor： Stefan Richter , Johannes Kindt , Veljko Milanovic
CPC classification number: B81B3/0078 , H02N1/008 , B81B2201/04 , B81B2203/0154 , B81B2203/058
Abstract: MEMS devices include a suspended element connected to a fixed part of a substrate by one or more flexures, wherein the one or more flexures are configured to permit movement of the suspended element relative to a fixed part of the substrate. A sensor coupled to the suspended element and a damping structure coupled to the suspended element extends into a gap between the suspended element and the fixed part of the substrate. One or more fluid confinement structures are configured to permit movement of the damping structure within a limited portion of the gap and to confine a viscoelastic fluid to the limited portion of the gap.
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