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公开(公告)号：US10465959B2
公开(公告)日：2019-11-05
申请号：US14914519
申请日：2014-10-23
摘要： A heat pump device and an organic Rankine cycle device that are capable of maintaining a stable thermal cycle even when an HFO or HCFO is used as the refrigerant. The refrigerant circulation device uses a refrigerant, wherein the refrigerant includes a hydrofluoroolefin or hydrochlorofluoroolefin having a carbon-carbon double bond within the molecular structure, and a reaction suppression unit which suppresses an isomerization reaction of the refrigerant is provided within the refrigerant circulation circuit.
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2.发明授权公开(公告)号：US10443912B2
公开(公告)日：2019-10-15
申请号：US14914589
申请日：2014-10-23
摘要： The present invention provides a heat pump device and an organic Rankine cycle device that are capable of maintaining a stable thermal cycle even when an HFO is used as the refrigerant in an environment in which the operating temperature reaches a high temperature. The refrigerant circulation device is filled with a refrigerant comprising a hydrofluoroolefin or hydrochlorofluoroolefin having a carbon-carbon double bond within the molecular structure, and has a region in the refrigerant circulation circuit where the operating temperature of the refrigerant reaches 175° C. or higher, wherein an acid suppression unit which suppresses any increase in the acid concentration in the refrigerant is provided in the region where the operating temperature of the refrigerant can reach 175° C. or higher, and the acid suppression unit contains an acid suppression material comprising at least two materials selected from the group consisting of copper, iron, aluminum, SUS, nickel, titanium, metallic silicon, silicon steel, tin, magnesium and zinc as the main components.
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公开(公告)号：US11441821B2
公开(公告)日：2022-09-13
申请号：US16489622
申请日：2018-06-28
发明人： Ryosuke Suemitsu , Kenji Ueda , Yasushi Hasegawa , Kazuki Wajima , Yoshinori Akamatsu , Fuyuhiko Sakyu , Kanako Osafune
摘要： It is an object of the present invention to provide a heat pump that can use, as a refrigerant, a substance with which a geometric isomer exists, and a method for designing the same. The present invention is a method for designing a heat pump (1) whose closed circuit configured by connecting a compressor (2), a condenser (3), an expansion valve (4), and an evaporator (5) in this order is filled with a refrigerant containing a refrigerant substance with which a geometric isomer may exist, the method including obtaining an upper limit of stable temperature at which isomerization of the refrigerant substance does not proceed, and setting an upper limit usage temperature of the heat pump (1) so as not to exceed the upper limit of the stable temperature.
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