公开(公告)号：US20220392690A1

公开(公告)日：2022-12-08

申请号：US17770287

申请日：2021-08-20

Applicant: MODA-INNOCHIPS CO., LTD.

Inventor： Gyeong Tae KIM ,  Tae Geun SEO ,  Sang Hoon SHIN ,  Jin Su JEONG

IPC: H01F27/28 ,  H01F27/02 ,  H01F41/04 ,  H01F27/29

Abstract: The present disclosure relates to an electronic component and a method for manufacturing the same, and more particularly, to a surface mounting type electronic component provided on an electronic device and a method for manufacturing the same.
An electronic component in accordance with an exemplary embodiment includes a main body part having a polyhedral shape and including a recessed portion formed as at least a portion of a plurality of edges at which two mutually adjacent surfaces meet is recessed, an insulation part provided on a surface of the main body part to cover the recessed portion, and an electrode part separately provided on the surface of the main body part except for an area on which the insulation part is provided.