Abstract:
A semiconductor device includes a Dynamic Random Access Memory (DRAM) memory array. The DRAM memory array includes a plurality of DRAM memory cells. Each of the DRAM memory cells includes a capacitor. Switching circuitry within the semiconductor device is configured to be switched to a state in which the switching circuitry connects capacitors of at least two of the DRAM memory cells together to provide a bulk capacitance between a first node and a second node.