公开(公告)号：US11622470B2

公开(公告)日：2023-04-04

申请号：US16885013

申请日：2020-05-27

Applicant: Magic Leap, Inc.

Inventor： Guillermo Padin Rohena ,  Mohammad Amin Godil ,  Anthony Wayne Cuteri

IPC: H05K7/20 ,  G02B27/01

Abstract: A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.