公开(公告)号：US5799771A

公开(公告)日：1998-09-01

申请号：US745502

申请日：1996-11-12

申请人： Manfred Schneider ,  Dietmar Clauss

发明人： Manfred Schneider ,  Dietmar Clauss

IPC分类号： H01H1/023 ,  H01H11/04 ,  H01H11/06 ,  H01H1/02

CPC分类号： H01H1/0231 ,  H01H11/045 ,  Y10T29/49213 ,  Y10T29/53896 ,  Y10T29/539

摘要： A contact includes a silver contact base, an intermediate silver layer and a solder in the form of a platelet being provisionally fastened or tacked to the intermediate silver layer prior to an actual soldering operation. The silver contact base is soldered onto a contact carrier by the intermediate silver layer and the solder platelet. A method for making a contact includes pressing an intermediate silver layer onto a silver contact base, then provisionally fastening or tacking a solder in the form of a platelet to the intermediate silver layer and subsequently placing a contact carrier on the solder platelet and soldering the contact carrier to the solder platelet.

摘要翻译： 在实际的焊接操作之前，触点包括银接触基底，中间银层和以血小板形式的焊料临时固定或固定到中间银层。 银接触基底通过中间银层和焊料血小板焊接到接触载体上。 制造接触的方法包括将中间银层压在银接触基底上，然后将片状的焊料临时固定或固定到中间银层，随后将接触载体放置在焊料片上并焊接接触 载体到焊剂血小板。

公开(公告)号：US5598629A

公开(公告)日：1997-02-04

申请号：US254128

申请日：1994-06-06

申请人： Manfred Schneider ,  Dietmar Clauss

发明人： Manfred Schneider ,  Dietmar Clauss

IPC分类号： H01H1/023 ,  H01H11/04 ,  H01H11/06 ,  H01R43/20

CPC分类号： H01H1/0231 ,  H01H11/045 ,  Y10T29/49213 ,  Y10T29/53896 ,  Y10T29/539

摘要： A contact includes a silver contact base, an intermediate silver layer and a solder in the form of a platelet being provisionally fastened or tacked to the intermediate silver layer prior to an actual soldering operation. The silver contact base is soldered onto a contact carrier by the intermediate silver layer and the solder platelet. A method for making a contact includes pressing an intermediate silver layer onto a silver contact base, then provisionally fastening or tacking a solder in the form of a platelet to the intermediate silver layer and subsequently placing a contact carrier on the solder platelet and soldering the contact carrier to the solder platelet.

摘要翻译： 在实际的焊接操作之前，触点包括银接触基底，中间银层和以血小板形式的焊料临时固定或固定到中间银层。 银接触基底通过中间银层和焊料血小板焊接到接触载体上。 制造接触的方法包括将中间银层压在银接触基底上，然后将片状的焊料临时固定或固定到中间银层，随后将接触载体放置在焊料片上并焊接接触 载体到焊剂血小板。