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公开(公告)号:US20110308457A1
公开(公告)日:2011-12-22
申请号:US13142557
申请日:2009-12-29
IPC分类号: C23C16/50
CPC分类号: H05H1/2406 , H05H2001/2412 , H05H2001/485
摘要: The invention relates to an apparatus for treating an object using a plasma process. The apparatus comprises a plasma reactor including a metal cylinder covered by a dielectric layer. Further, the apparatus comprises an electrode structure arranged radially outside the metal cylinder for generating the plasma process. The apparatus also comprises a supporting structure for locating the object to be treated at a pre-defined distance from the plasma reactor.
摘要翻译: 本发明涉及一种使用等离子体工艺处理物体的装置。 该装置包括等离子体反应器,其包括被电介质层覆盖的金属圆柱体。 此外,该装置包括在金属圆筒的径向外侧布置的用于产生等离子体工艺的电极结构。 该设备还包括用于以等离子体反应器预定距离定位被处理物体的支撑结构。