公开(公告)号：US09190353B2

公开(公告)日：2015-11-17

申请号：US14142924

申请日：2013-12-30

申请人： Mariano Layson Ching, Jr. ,  Allen M. Descartin ,  Bo Li

发明人： Mariano Layson Ching, Jr. ,  Allen M. Descartin ,  Bo Li

IPC分类号： H01L23/495 ,  H01L23/31

CPC分类号： H01L23/49575 ,  H01L23/3107 ,  H01L23/49503 ,  H01L23/49531 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A semiconductor chip package includes a lead frame having a die paddle, leads surrounding the paddle and a central window through the paddle. A substrate has a base side and a superior side. A peripheral portion of the base side is secured to the paddle and a central portion of the base side is exposed through the central window. A semiconductor chip is secured to the superior side of the substrate. The semiconductor chip is electrically connected to the plurality of leads and the substrate. A mold compound covers at least portions of the lead frame, the substrate and the semiconductor chip. The chip package can be electrically connected to other devices or a circuit board by way of the leads and BGA pads of the substrate exposed in the central window.

摘要翻译： 半导体芯片封装包括具有管芯焊盘的引线框架，围绕焊盘的引线和通过焊盘的中心窗口。 基底具有基底侧和上侧。 底侧的周边部分固定在桨上，底侧的中心部分通过中心窗露出。 半导体芯片固定到基板的上侧。 半导体芯片电连接到多个引线和基板。 模具化合物覆盖引线框架，基板和半导体芯片的至少一部分。 芯片封装可以通过在中心窗口中暴露的衬底的引线和BGA焊盘电连接到其他器件或电路板。