公开(公告)号：US07403391B2

公开(公告)日：2008-07-22

申请号：US11681762

申请日：2007-03-03

申请人： Mark Germagian ,  James VanGilder ,  Jason Dudek

发明人： Mark Germagian ,  James VanGilder ,  Jason Dudek

IPC分类号： H05K7/20 ,  F24F13/08

CPC分类号： H05K7/20745

摘要： A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

摘要翻译： 数据中心包括具有前表面和后表面的电子设备机架和靠近机架定位的冷却单元，所述冷却单元具有前表面和后表面，所述冷却单元被配置为从前面排出冷却空气 冷却单元的表面用于冷却机架。 冷却单元构造成沿着机架前表面的高度的大部分释放冷却的空气。

公开(公告)号：US07259963B2

公开(公告)日：2007-08-21

申请号：US11025567

申请日：2004-12-29

申请人： Mark Germagian ,  James VanGilder ,  Jason Dudek

发明人： Mark Germagian ,  James VanGilder ,  Jason Dudek

IPC分类号： H05K7/20

CPC分类号： H05K7/20745

摘要： A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

摘要翻译： 数据中心包括具有前表面和后表面的电子设备机架和靠近机架定位的冷却单元，所述冷却单元具有前表面和后表面，所述冷却单元被配置为从前面排出冷却空气 冷却单元的表面用于冷却机架。 冷却单元构造成沿着机架前表面的高度的大部分释放冷却的空气。

公开(公告)号：US20070146994A1

公开(公告)日：2007-06-28

申请号：US11681762

申请日：2007-03-03

申请人： Mark Germagian ,  James VanGilder ,  Jason Dudek

发明人： Mark Germagian ,  James VanGilder ,  Jason Dudek

IPC分类号： H05K7/20

CPC分类号： H05K7/20745

摘要： A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

摘要翻译： 数据中心包括具有前表面和后表面的电子设备机架和靠近机架定位的冷却单元，所述冷却单元具有前表面和后表面，所述冷却单元被配置为从前面排出冷却空气 冷却单元的表面用于冷却机架。 冷却单元构造成沿着机架前表面的高度的大部分释放冷却的空气。

公开(公告)号：US20060139877A1

公开(公告)日：2006-06-29

申请号：US11025567

申请日：2004-12-29

申请人： Mark Germagian ,  James VanGilder ,  Jason Dudek

发明人： Mark Germagian ,  James VanGilder ,  Jason Dudek

IPC分类号： H05K7/20

CPC分类号： H05K7/20745

摘要： A data center includes an electronic equipment rack having a front face and a back face and a cooling unit positioned adjacent to the rack, the cooling unit having a front face and a back face, the cooling unit being configured to exhaust cooled air from the front face of the cooling unit to cool the rack. The cooling unit is configured to release the cooled air along a substantial portion of a height of the front face of the rack.

摘要翻译： 数据中心包括具有前表面和后表面的电子设备机架和靠近机架定位的冷却单元，所述冷却单元具有前表面和后表面，所述冷却单元被配置为从前面排出冷却空气 冷却单元的表面用于冷却机架。 冷却单元构造成沿着机架前表面的高度的大部分释放冷却的空气。