公开(公告)号：US20050239294A1

公开(公告)日：2005-10-27

申请号：US11112880

申请日：2005-04-22

申请人： Martin Rosenblum ,  Xi Chu ,  Lorenza Moro ,  Kenneth Nelson ,  Paul Burrows ,  Mark Gross ,  Mac Zumhoff ,  Peter Martin ,  Charles Bonham ,  Gordon Graff

发明人： Martin Rosenblum ,  Xi Chu ,  Lorenza Moro ,  Kenneth Nelson ,  Paul Burrows ,  Mark Gross ,  Mac Zumhoff ,  Peter Martin ,  Charles Bonham ,  Gordon Graff

IPC分类号： H01L21/02 ,  H01L21/00 ,  H01L51/00 ,  H01L51/56 ,  H01L21/469

CPC分类号： C23C14/568 ,  B05D1/60 ,  B05D3/067 ,  B05D7/52 ,  H01L21/67155 ,  H01L21/67207 ,  H01L21/67236 ,  H01L51/0001 ,  H01L51/001 ,  H01L51/5237 ,  H01L51/5256 ,  H01L51/56 ,  H01L2251/5338

摘要： A tool for depositing multilayer coatings onto a substrate. In one configuration, the tool includes a includes an in-line organic material deposition station operating under at least one of a pressure or temperature controlled environment. In another, it further is of a hybrid design that incorporates both in-line and cluster tool features. In this latter configuration, at least one of the deposition stations is configured to deposit an inorganic layer, while at least one other deposition station is configured to deposit an organic layer. The tool is particularly well-suited to depositing multilayer coatings onto discrete substrates, as well as to encapsulating environmentally-sensitive devices placed on the flexible substrate.

摘要翻译： 用于将多层涂层沉积到基底上的工具。 在一种配置中，该工具包括在压力或温度受控环境中的至少一个下操作的在线有机材料沉积站。 另一方面，它进一步是兼并在线和集群工具功能的混合设计。 在后一种构造中，至少一个沉积站配置成沉积无机层，而至少一个其它沉积站被配置成沉积有机层。 该工具特别适用于将多层涂层沉积到分立的基板上，以及封装放置在柔性基板上的环境敏感设备。

公开(公告)号：US20060216951A1

公开(公告)日：2006-09-28

申请号：US11439474

申请日：2006-05-23

申请人： Lorenza Moro ,  Xi Chu ,  Martin Rosenblum ,  Kenneth Nelson ,  Paul Burrows ,  Mark Gross ,  Mac Zumhoff ,  Peter Martin ,  Charles Bonham ,  Gordon Graff

发明人： Lorenza Moro ,  Xi Chu ,  Martin Rosenblum ,  Kenneth Nelson ,  Paul Burrows ,  Mark Gross ,  Mac Zumhoff ,  Peter Martin ,  Charles Bonham ,  Gordon Graff

IPC分类号： H01L21/31

CPC分类号： C23C14/0694 ,  H01L51/5256 ,  H01L51/56

摘要： A method of making an encapsulated plasma sensitive device. The method comprises: providing a plasma sensitive device adjacent to a substrate; depositing a plasma protective layer on the plasma sensitive device using a process selected from non-plasma based processes, or modified sputtering processes; and depositing at least one barrier stack adjacent to the plasma protective layer, the at least one barrier stack comprising at least one decoupling layer and at least one barrier layer, the plasma sensitive device being encapsulated between the substrate and the at least one barrier stack, wherein the decoupling layer, the barrier layer, or both are deposited using a plasma process, the encapsulated plasma sensitive device having a reduced amount of damage caused by the plasma compared to an encapsulated plasma sensitive device made without the plasma protective layer. An encapsulated plasma sensitive device is also described.

摘要翻译： 一种制造封装等离子体敏感装置的方法。 该方法包括：提供与衬底相邻的等离子体敏感器件; 使用选自非等离子体工艺或改进的溅射工艺的工艺在等离子体敏感器件上沉积等离子体保护层; 以及沉积与所述等离子体保护层相邻的至少一个势垒堆叠，所述至少一个势垒堆叠包括至少一个去耦层和至少一个势垒层，所述等离子体敏感器件封装在所述衬底和所述至少一个阻挡层之间， 其中使用等离子体工艺沉积去耦层，阻挡层或两者，所述封装等离子体敏感器件与不具有等离子体保护层的封装的等离子体感应器件相比，具有由等离子体引起的损伤量减少。 还描述了封装的等离子体敏感器件。